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  1. ÀîÃ÷µÈ£¬¡¶ßäßòÀà¹Ì»¯¼ÁÔÚ×躸ÓÍÄ«ÖеÄÓ¦ÓÃÑо¿¡·£¬¡¶¾«Ï¸»¯¹¤¡·£¬2020ÄêµÚ37¾íµÚ6ÆÚ£¬pp. 112¨C117.
  2. ÕÅ࣬¡¶»·ÑõÊ÷֬DZ·üÐ͹̻¯¼ÁµÄÑо¿½øÕ¹¡·£¬¡¶¸ß·Ö×Óͨ±¨¡·£¬2019Ä꣬no. 3£¬pp. 45¨C52.
  3. Íõ·¼µÈ£¬¡¶ÐÂÐÍßäßò΢½ºÄҹ̻¯¼ÁµÄÖÆ±¸ÓëÐÔÄÜÑо¿¡·£¬¡¶Öйú½ºÕ³¼Á¡·£¬2021ÄêµÚ30¾íµÚ4ÆÚ£¬pp. 28¨C33.

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  1. h. tanaka et al., "curing behavior and thermal properties of epoxy resins using imidazole derivatives as latent curing agents", journal of applied polymer science, 2017, vol. 134, no. 12.
  2. y. sato et al., "development of high-performance solder resist inks with imidazole-based curing systems", ieee transactions on components, packaging and manufacturing technology, 2018, vol. 8, issue 5.
  3. m. r. kamal and s. sourour, "kinetics and mechanism of epoxy resin curing with imidazoles", polymer engineering & science, 1973, vol. 13, no. 1, pp. 59¨C64.

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