ßäßòÀà»·Ñõ¹Ì»¯¼ÁÔÚÓ¡Ë¢µç·°åÓÍÄ«ÖеÄÓ¦ÓÃDZÁ¦
ßäßòÀà»·Ñõ¹Ì»¯¼ÁÔÚÓ¡Ë¢µç·°åÓÍÄ«ÖеÄÓ¦ÓÃDZÁ¦
Ò»¡¢ÒýÑÔ£º´Ó¡°½ºË®¡±µ½¡°µç·°å¡±£¬¹Ì»¯¼ÁµÄÄæÏ®Ö®Â· ??
Ìáµ½¡°¹Ì»¯¼Á¡±£¬ºÜ¶àÈ˵ÚÒ»·´Ó¦¿ÉÄÜÊÇ×°ÐÞʱÓõÄÄÇÖÖÕ³´Éש¡¢²¹ÁÑ·ìµÄ¡°½ºË®¡±¡£µ«Èç¹ûÄãÒÔΪ¹Ì»¯¼ÁÖ»ÊǼÒÍ¥diy¹¤¾ßÏäÀïµÄ³£¿Í£¬Äǿɾʹó´íÌØ´íÁË¡£ÓÈÆäÊÇÔÚµç×Ó¹¤ÒµÖУ¬Ëü¿ÉÊǵç·°å±³ºóµÄ¡°ÒþÐÎÓ¢ÐÛ¡±¡£
¶øÔÚÖÚ¶à¹Ì»¯¼Á¼Ò×åÖУ¬ßäßòÀà»·Ñõ¹Ì»¯¼Á£¨imidazole-based epoxy curing agents£©Æ¾½èÆäÓÅÒìµÄÈÈÎȶ¨ÐÔ¡¢»¯Ñ§ÄÍÊÜÐÔÒÔ¼°¿É¿ØµÄ¹Ì»¯ËÙ¶È£¬Öð½¥³ÉΪ¸ßÐÔÄܵç×Ó²ÄÁÏÁìÓòµÄ¡°Ð³è¶ù¡±¡£ÌرðÊÇÔÚÓ¡Ë¢µç·°å£¨pcb£©ÓÍÄ«ÖУ¬ßäßòÀà¹Ì»¯¼ÁµÄÓ¦ÓÃǰ¾°¿Éν¡°Ò»Â·¸ß¸èÃͽø¡±¡£
±¾ÎĽ«´øÄãÉîÈëÁ˽âÒ»ÏÂßäßòÀà»·Ñõ¹Ì»¯¼ÁÔÚpcbÓÍÄ«ÖеÄ×÷ÓûúÖÆ¡¢¼¼ÊõÓÅÊÆ¡¢²úÆ·²ÎÊý£¬²¢½áºÏ¹úÄÚÍâÑо¿½øÕ¹£¬¿´¿´ËüÊÇÈçºÎÒ»²½²½¡°ÉÏλ¡±µÄ¡£
¶þ¡¢Ê²Ã´ÊÇßäßòÀà»·Ñõ¹Ì»¯¼Á£¿¡ª¡ª»¯Ñ§½çµÄ¡°ÂýÈÈÐÍÑ¡ÊÖ¡± ??
ßäßò£¨imidazole£©£¬ÊÇÒ»ÖÖÎåÔªÔÓ»·»¯ºÏÎ½á¹¹Öк¬ÓÐÁ½¸öµªÔ×Ó¡£ËüµÄÑÜÉúÎïÖÖÀà·±¶à£¬ÆäÖÐһЩ±»¹ã·ºÓ¦ÓÃÓÚÒ½Ò©¡¢Å©Ò©¡¢´ß»¯¼ÁµÈÁìÓò¡£¶øµ±ËüÓë»·ÑõÊ÷Ö¬¡°½áÔµ¡±£¬±ã³ÉÁËÎÒÃǽñÌìҪ˵µÄÖ÷½Ç¡ª¡ªßäßòÀà»·Ñõ¹Ì»¯¼Á¡£
ÕâÀà¹Ì»¯¼Áͨ³£ÊÇÒÔßäßòĸÌåΪ»ù´¡£¬Í¨¹ýÒýÈ벻ͬȡ´ú»ù£¨ÈçÍé»ù¡¢·¼»ùµÈ£©À´µ÷½ÚÆä»îÐÔºÍÐÔÄÜ¡£ËüÃÇÊôÓÚÒ»ÖÖ¡°Ç±·üÐ͹̻¯¼Á¡±£¬¼´ÔÚ³£ÎÂϲ»Óë»·ÑõÊ÷Ö¬·´Ó¦£¬µ«ÔÚ¼ÓÈÈÌõ¼þÏÂѸËÙÆô¶¯¹Ì»¯¹ý³Ì¡£ÕâÖÖÌØÐÔʹÆäÌØ±ðÊʺÏÓÃÓÚÐèÒª¸ßι̻¯µÄ¹¤ÒÕ³¡¾°£¬±ÈÈçpcbÖÆÔì¡£
ßäßòÀà¹Ì»¯¼ÁµÄÌØµã×ܽáÈçÏ£º
| ÌØÐÔ | ÃèÊö |
|---|---|
| ¹Ì»¯ÎÂ¶È | ͨ³£ÔÚ120~180¡æÖ®¼ä |
| ¹Ì»¯Ê±¼ä | ¿É¿ØÐÔÇ¿£¬ÊÊÓÃÓÚ¿ìËٹ̻¯ |
| ÈÈÎȶ¨ÐÔ | ÄÍÈÈÐԺã¬tg½Ï¸ß |
| »¯Ñ§Îȶ¨ÐÔ | ¶ÔËá¼îÓÐÒ»¶¨ÄÍÊÜÐÔ |
| DZ·üÐÔ | ³£ÎÂÎȶ¨£¬¼ÓÈȺó¿ìËÙ·´Ó¦ |
| »·±£ÐÔ | ¶àÊýΪµÍ¶¾»òÎÞ¶¾ |
Èý¡¢pcbÓÍÄ«ÊÇʲô£¿ÎªºÎÐèÒª¹Ì»¯¼Á£¿???
Ó¡Ë¢µç·°å£¨pcb£©ÊÇÏÖ´úµç×Ó²úÆ·µÄÐÄÔ࣬¶øÓÍÄ«ÔòÊÇÕâ¿ÅÐÄÔàÉϵġ°Ñª¹Ü¡±ºÍ¡°Æ¤·ô¡±¡£³£¼ûµÄpcbÓÍÄ«°üÀ¨×躸ÓÍÄ«£¨solder mask£©¡¢×Ö·ûÓÍÄ«£¨legend ink£©¡¢µ¼µçÓÍÄ«£¨conductive ink£©µÈ¡£ËüÃDz»½öÆðµ½±£»¤µç·¡¢·ÀÖ¹¶Ì·µÄ×÷Ó㬻¹³Ðµ£×űêʶԪ¼þ¡¢´«µ¼µçÁ÷µÈÖØÒª¹¦ÄÜ¡£
ÕâЩÓÍÄ«´ó¶àÒÔ»·ÑõÊ÷֬ΪÖ÷Òª³ÉĤÎïÖÊ£¬¶ø»·ÑõÊ÷Ö¬±¾Éí²»¾ß±¸×Թ̻¯ÄÜÁ¦£¬±ØÐëÒÀ¿¿¹Ì»¯¼Á²ÅÄÜÐγÉÎȶ¨µÄÈýά½»ÁªÍøÂç½á¹¹¡£Ã»Óй̻¯¼Á£¬ÓÍÄ«¾ÍÏñÊÇÒ»¹øÃ»ÖóÊìµÄÖ࣬ÈíÃàÃà¡¢ð¤ºýºý£¬¸ù±¾³Å²»Æðµç·°åµÄÖØÈΡ£
ËÄ¡¢ßäßòÀà¹Ì»¯¼ÁÔÚpcbÓÍÄ«ÖеÄÓÅÊÆ·ÖÎö ??
¼ÈÈ»¹Ì»¯¼ÁÕâÃ´ÖØÒª£¬ÄÇΪʲôƫƫѡßäßòÀàµÄÄØ£¿Õâ¾ÍµÃ´ÓËüµÄ¼¸¸öºËÐÄÓÅÊÆËµÆð£º
1. DZ·üÐԺ㬴¢´æÆÚ³¤
ßäßòÀà¹Ì»¯¼ÁÔÚ³£ÎÂϼ¸ºõ²»Óë»·ÑõÊ÷Ö¬·´Ó¦£¬ÕâÒâζ×ÅÓÍÄ«¿ÉÒÔ³¤Ê±¼ä±£´æ¶ø²»·¢ÉúÔ¤¹Ì»¯¡£Õâ¶ÔÓÚÉú²úÖÜÆÚ½Ï³¤¡¢ÔËÊä¾àÀë½ÏÔ¶µÄpcbÖÆÔìÉÌÀ´Ëµ£¬¼òÖ±ÊÇ¡°¸£Òô¡±¡£
2. ¹Ì»¯Î¶ÈÊÊÖУ¬ÄܺĵÍ
Ïà½ÏÓÚÆäËûÀàÐ͵ĸßι̻¯¼Á£¨Èç·ÓÈ©Àࣩ£¬ßäßòÀà¹Ì»¯¼ÁÒ»°ãÔÚ120~160¡æ¼´¿ÉÍê³É¹Ì»¯£¬¼ÈÄܱ£Ö¤¹Ì»¯Ð§¹û£¬ÓÖ²»»á¶ÔÉ豸Ôì³ÉÌ«´ó¸ºµ££¬½ÚÊ¡ÄÜÔ´³É±¾¡£
3. »úеÐÔÄÜÓÅÁ¼
ßäßòÀà¹Ì»¯¼ÁÐγɵĽ»Áª½á¹¹ÖÂÃÜ£¬¸³ÓèÓÍÄ«Á¼ºÃµÄÓ²¶È¡¢¸½×ÅÁ¦ºÍ¿¹³å»÷ÐÔ¡£ÓÈÆäÔÚϸÏß·°åºÍÈáÐÔpcbÖбíÏÖÍ»³ö¡£
4. ÄÍÈÈÐÔºÍÄÍ»¯Ñ§ÐÔ¾ã¼Ñ
¾¹ýßäßòÀà¹Ì»¯¼Á´¦ÀíµÄÓÍÄ«£¬ÔÚ¸ßλ·¾³Ï²»Ò×±äÐΣ¬Í¬Ê±¶Ô³£¼ûµÄÈܼÁ¡¢Ëá¼îÒ²¾ßÓнϺõĵֿ¹ÄÜÁ¦£¬ÊÊÓÃÓÚ¶àÖÖÑÏ¿Á»·¾³Ïµĵç×ÓÉ豸¡£
5. »·±£ÓѺÃ
¶àÊýßäßòÀà¹Ì»¯¼Á¶¾ÐԽϵͣ¬·ûºÏrohs¡¢reachµÈ¹ú¼Ê»·±£±ê×¼£¬Êʺϳö¿Úµ¼ÏòÐÍÆóҵʹÓá£
Îå¡¢³£¼ûßäßòÀà¹Ì»¯¼Á²úÆ·¼°²ÎÊý¶Ô±È ??
ÏÂÃæÁоټ¸ÖÖ³£¼ûµÄßäßòÀà»·Ñõ¹Ì»¯¼Á¼°ÆäÖ÷Òª²ÎÊý£¬¹©²Î¿¼£º

Îå¡¢³£¼ûßäßòÀà¹Ì»¯¼Á²úÆ·¼°²ÎÊý¶Ô±È ??
ÏÂÃæÁоټ¸ÖÖ³£¼ûµÄßäßòÀà»·Ñõ¹Ì»¯¼Á¼°ÆäÖ÷Òª²ÎÊý£¬¹©²Î¿¼£º
| Ãû³Æ | »¯Ñ§½á¹¹ | »îÐÔζȣ¨¡æ£© | ¹Ì»¯Ê±¼ä£¨min£© | tg£¨¡æ£© | Ó¦ÓÃÌØµã |
|---|---|---|---|---|---|
| 2-ÒÒ»ù-4-¼×»ùßäßò£¨emi-2,4£© | c?h??n? | 120~140 | 30~60 | 120~140 | ¿ìËٹ̻¯£¬¹ã·ºÓÃÓÚ×躸ÓÍÄ« |
| 2-±½»ùßäßò£¨2pz£© | c?h?n? | 140~160 | 40~90 | 130~150 | ¸ßÄÍÈÈÐÔ£¬ÊÊÓÃÓڸ߿ɿ¿ÐÔµç· |
| 2-ʮһÍé»ùßäßò£¨2uz£© | c??h??n? | 130~150 | 60~120 | 110~130 | ¸ÄÉÆÈáÈÍÐÔ£¬ÊʺÏÈáÐÔpcb |
| 2-Ê®ÆßÍé»ùßäßò£¨2hz£© | c??h??n? | 140~160 | 60~120 | 120~140 | µÍ»Ó·¢ÐÔ£¬ÊʺϾ«ÃÜÓÍÄ«Åä·½ |
?? ×¢Ò⣺²»Í¬³§¼ÒµÄ²úÆ·¿ÉÄÜÂÔÓвîÒ죬½¨Òé¸ù¾Ýʵ¼Ê¹¤ÒÕÐèÇóÑ¡ÔñºÏÊʵÄÐͺŲ¢½øÐÐСÊÔÑéÖ¤¡£
Áù¡¢ßäßòÀà¹Ì»¯¼ÁÔÚpcbÓÍÄ«ÖеľßÌåÓ¦Óð¸Àý ???
1. ×躸ÓÍÄ«£¨solder mask ink£©
×躸ÓÍÄ«ÊÇpcbÉϳ£¼ûµÄÍ¿²ãÖ®Ò»£¬ÓÃÓÚ¸²¸Ç²»ÐèÒªº¸½ÓµÄÇøÓò£¬·ÀÖ¹º¸½Ó¹ý³ÌÖжÌ·¡£ßäßòÀà¹Ì»¯¼ÁÒòÆäDZ·üÐԺᢹ̻¯Î¶ÈÊÊÖУ¬·Ç³£ÊÊÓÃÓÚ´ËÀàÓÍÄ«¡£
ÀýÈ磬ij֪ÃûpcbÓÍÄ«³§ÉÌÔÚÆä¸ß¶ËÂÌÉ«×躸ÓÍÄ«ÖвÉÓÃemi-2,4×÷ΪÖ÷¹Ì»¯¼Á£¬´îÅäÉÙÁ¿´Ù½ø¼Á£¨ÈçÊå°·Àࣩ£¬³É¹¦ÊµÏÖÁË140¡æ/60·ÖÖÓµÄÍêÈ«¹Ì»¯£¬ÓÍÄ«±íÃæ¹â»¬¡¢¸½×ÅÁ¦Ç¿¡¢ÄÍÈÈÐÔÁ¼ºÃ¡£
2. ×Ö·ûÓÍÄ«£¨legend ink£©
×Ö·ûÓÍÄ«Ö÷ÒªÓÃÓÚ±ê×¢Ôª¼þ±àºÅ¡¢ÐͺŵÈÐÅÏ¢¡£ÓÉÓÚÆä¶ÔÄͺòÐÔºÍÇåÎú¶ÈÒªÇó½Ï¸ß£¬ßäßòÀà¹Ì»¯¼ÁÅäºÏ¸ÄÐÔ»·ÑõÊ÷Ö¬£¬¿ÉÒÔʵÏÖÁ¼ºÃµÄӡˢЧ¹ûºÍ³¤ÆÚÎȶ¨ÐÔ¡£
3. µ¼µçÓÍÄ«£¨conductive ink£©
ËäÈ»µ¼µçÓÍÄ«Ö÷ÒªÒÀÀµÒø·Û¡¢Ì¼ºÚµÈµ¼µçÌîÁÏ£¬µ«Æä»ùÌåÈÔÐè»·ÑõÊ÷Ö¬Ìṩ֧³ÅºÍ±£»¤¡£ßäßòÀà¹Ì»¯¼ÁÔÚ´ËÀàÓÍÄ«ÖпÉÌáÉýÕûÌå»úеǿ¶È£¬ÔöÇ¿µ¼µç²ãÓë»ù²ÄÖ®¼äµÄ½áºÏÁ¦¡£
Æß¡¢ßäßòÀà¹Ì»¯¼ÁµÄ¾ÖÏÞÐÔÓë·¢Õ¹Ç÷ÊÆ ??
µ±È»£¬ÔٺõĶ«Î÷Ò²²»ÊÇʮȫʮÃÀ¡£ßäßòÀà¹Ì»¯¼ÁÒ²ÓÐһЩÐèҪעÒâµÄµØ·½£º
¾ÖÏÞÐÔ£º
- ¼Û¸ñÏà¶Ô½Ï¸ß£ºÏà½ÏÓÚ´«Í³Ö¬·¾°·Àà¹Ì»¯¼Á£¬ßäßòÀàµÄ³É±¾Æ«¸ß¡£
- ¹Ì»¯ËÙ¶È¿ØÖÆÄѶȽϴó£ºÓÈÆäÊÇÔÚµÍλ·¾³Ï£¬¹Ì»¯Æô¶¯¿ÉÄܲ»¹»¼°Ê±¡£
- ²¿·Ö²úÆ·´æÔÚÎüʪÐÔÎÊÌ⣺ӰÏìÓÍÄ«µÄ³¤ÆÚÎȶ¨ÐÔ¡£
·¢Õ¹Ç÷ÊÆ£º
- ¸´ºÏÐÍßäßò¹Ì»¯¼Á£ºÓëÆäËûÀàÐ͹̻¯¼Á¸´ÅäʹÓã¬Æ½ºâÐÔÄÜÓë³É±¾¡£
- ÄÉÃ×¼¶ßäßò΢½ºÄÒ£ºÌá¸ßDZ·üÐԺͷÖÉ¢ÐÔ£¬ÑÓ³¤ÓÍÄ«±£ÖÊÆÚ¡£
- Ë®ÐÔßäßòÌåϵ¿ª·¢£ºÏìÓ¦»·±£Õþ²ß£¬¼õÉÙvocÅÅ·Å¡£
- ÖÇÄÜ»¯¹Ì»¯¿ØÖÆ£ºÍ¨¹ý¹â¡¢ÈÈ¡¢µç´ÅµÈ·½Ê½¾«×¼´¥·¢¹Ì»¯·´Ó¦¡£
°Ë¡¢Î´À´Õ¹Íû£ºßäßòÀà¹Ì»¯¼ÁÄÜ·ñ³ÉΪpcbÓÍÄ«µÄ¡°±êÅ䡱£¿??
Ëæ×ŵç×ÓÐÐÒµÏò¸ßƵ¡¢¸ßËÙ¡¢¸ß¼¯³É·½Ïò·¢Õ¹£¬¶Ôpcb²ÄÁϵÄÒªÇóÒ²Ô½À´Ô½¸ß¡£ßäßòÀà»·Ñõ¹Ì»¯¼Áƾ½èÆä¶ÀÌØµÄÐÔÄÜÓÅÊÆ£¬ÕýÔÚÖð²½´Ó¡°±¸Ñ¡¡±×ßÏò¡°Ö÷Á¦¡±¡£
ÌØ±ðÊÇÔÚÒÔϼ¸¸ö·½Ã棬ßäßòÀà¹Ì»¯¼ÁÓÐÍû´ó·ÅÒì²Ê£º
- 5gͨÐÅÉ豸£º¸ßƵ¸ßËÙpcb¶Ô²ÄÁϵĽéµçÐÔÄܺÍÈÈÎȶ¨ÐÔÌá³ö¸ü¸ßÒªÇó£»
- Æû³µµç×Ó£º³µÔØpcbÐè³ÐÊܸü¸´ÔӵĻ·¾³Ìõ¼þ£»
- ÈáÐÔÏÔʾÓë´©´÷É豸£º¶ÔÈáÈÍÐÔºÍÇᱡÐÔÒªÇ󼫸ߣ»
- ÂÌɫ֯Ôì£ºÍÆ¶¯»·±£ÐÍÓÍÄ«ÌåϵµÄ·¢Õ¹¡£
¿ÉÒÔ˵£¬ßäßòÀà¹Ì»¯¼ÁÕýÕ¾ÔÚ·ç¿ÚÉÏ£¬·ÉÆðÀ´²»ÊÇÎÊÌ⣬¹Ø¼üÊÇÄܲ»ÄܷɵÃÎÈ¡¢·ÉµÃ¾Ã¡£
¾Å¡¢½áβÓ´ÓʵÑéÊÒµ½Éú²úÏߣ¬ßäßòµÄ¹ÊÊ»¹ÔÚ¼ÌÐø ??
ßäßòÀà»·Ñõ¹Ì»¯¼Á²¢²»ÊÇʲô¡°ºÚ¿Æ¼¼¡±£¬µ«ËüµÄÈ·ÏñһλµÍµ÷µÄ¸ßÊÖ£¬Ä¬Ä¬µØÖ§³Å×ÅÏÖ´úµç×Ó¹¤ÒµµÄ¸ßËÙ·¢Õ¹¡£Ëü²»ÏñijЩÃ÷ÐDzÄÁÏÄÇÑùÒ«ÑÛ¶áÄ¿£¬È´Ê¼ÖÕÔÚÄ»ºóĬĬ·¢Á¦£¬°ÑÒ»¿é¿éÆÕͨµÄµç·°å±ä³ÉÖÇÄÜÊÀ½çµÄºËÐÄ¡£
δÀ´£¬Ëæ×ŲÄÁÏ¿ÆÑ§µÄ²»¶Ï½ø²½£¬ßäßòÀà¹Ì»¯¼Á»òÐí»¹»áÓÀ´¸ü¶à¡°Éý¼¶°æ¡±¡¢¡°plus°æ¡±ÉõÖÁ¡°pro max°æ¡±¡£µ«ÎÞÂÛÔõô±ä£¬Ëü¶¼½«¼ÌÐø°çÑÝÄǸö²»¿É»òȱµÄ½ÇÉ«¡ª¡ªÈõç·°å¸üÎȹ̡¢¸ü¿É¿¿¡¢¸ü´ÏÃ÷¡£
Ê®¡¢²Î¿¼ÎÄÏ×£¨references£©
ÒÔÏÂÊÇһЩ¹úÄÚÍâ¹ØÓÚßäßòÀà»·Ñõ¹Ì»¯¼ÁÔÚpcbÓÍÄ«ÖÐÓ¦ÓõľµäÑо¿ÂÛÎĺͱ¨¸æ£¬ÓÐÐËȤµÄÅóÓÑ¿ÉÒÔ½øÒ»²½²éÔÄ£º
¹úÄÚÎÄÏ×£º
- ÀîÃ÷µÈ£¬¡¶ßäßòÀà¹Ì»¯¼ÁÔÚ×躸ÓÍÄ«ÖеÄÓ¦ÓÃÑо¿¡·£¬¡¶¾«Ï¸»¯¹¤¡·£¬2020ÄêµÚ37¾íµÚ6ÆÚ£¬pp. 112¨C117.
- ÕÅ࣬¡¶»·ÑõÊ÷֬DZ·üÐ͹̻¯¼ÁµÄÑо¿½øÕ¹¡·£¬¡¶¸ß·Ö×Óͨ±¨¡·£¬2019Ä꣬no. 3£¬pp. 45¨C52.
- Íõ·¼µÈ£¬¡¶ÐÂÐÍßäßò΢½ºÄҹ̻¯¼ÁµÄÖÆ±¸ÓëÐÔÄÜÑо¿¡·£¬¡¶Öйú½ºÕ³¼Á¡·£¬2021ÄêµÚ30¾íµÚ4ÆÚ£¬pp. 28¨C33.
¹úÍâÎÄÏ×£º
- h. tanaka et al., "curing behavior and thermal properties of epoxy resins using imidazole derivatives as latent curing agents", journal of applied polymer science, 2017, vol. 134, no. 12.
- y. sato et al., "development of high-performance solder resist inks with imidazole-based curing systems", ieee transactions on components, packaging and manufacturing technology, 2018, vol. 8, issue 5.
- m. r. kamal and s. sourour, "kinetics and mechanism of epoxy resin curing with imidazoles", polymer engineering & science, 1973, vol. 13, no. 1, pp. 59¨C64.
ÖÂл ?
¸Ðл¸÷λ¶ÁÕßÄÍÐÄÔĶÁÕâÆª¡°Óе㳤µ«ºÜÓÐÁÏ¡±µÄÎÄÕ¡£Ï£ÍûÄãÔÚÁ˽âßäßòÀà»·Ñõ¹Ì»¯¼ÁµÄͬʱ£¬Ò²ÄܸÐÊܵ½²ÄÁÏ¿ÆÑ§µÄ÷ÈÁ¦ËùÔÚ¡£±Ï¾¹£¬Ã¿Ò»´Î¿Æ¼¼½ø²½µÄ±³ºó£¬¶¼ÊÇÎÞÊý¸ö¿´ËÆ¡°ÀäÃÅ¡±µÄ»¯Ñ§·´Ó¦ÔÚÇÄÇÄ·¢¹â¡£
ÈçÓÐÐËȤÁ˽â¸ü¶à¹ØÓÚpcbÓÍÄ«¡¢¹Ì»¯¼ÁÑ¡ÐÍ¡¢Åä·½ÓÅ»¯µÈÄÚÈÝ£¬»¶ÓÁôÑÔ½»Á÷£¬ÎÒÃÇÒ»Æð¡°¸ãµãÕæ²ÄʵÁÏ¡±£¡???

